四平半导体材料汉高ABLESTIKJM7000导电胶

乐泰EA 3335透明UV耐热耐水耐腐蚀光通讯光路胶

粘度 5000-7000cp 固化条件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg温度59ppm/℃ CTE,Tg值温度 ppm/℃

透明，UV快速固化，良好的耐热，耐水，耐化学腐蚀性，低挥发。

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300ºC N/mm² 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10ºC/ minute ramp from 25 to 400
ºC
@ 340ºC, % 0.2
@ 400ºC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300ºC
Volume Resistivity, ohm-cm ≤0.01

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