迪睿合NP605加热加温热熔胶NP203索尼胶带

迪睿合NP605加热加温热熔胶NP203索尼胶带
Low temperature heat activation type enables bonding at 90℃, and positive adhesion
performance is demonstrated in bonding by 100 ℃ or more. Its adhesive strength is retained
at a wide range of temperatures.
■ The tape is tack-free aｔ room temperature, enabling punching and spinning without release
paper. the design and appearance of the products on which it is used can be immensely
improved.
适用于铝板和金属、塑料等的粘合。适用于铝板和金属、塑料等的粘合。