No.6360-20
T:100um PO:90um Adhesive:10um High adhesion for chip flying
NO.636020 Dicing tape (for Wafer)
Dicing tapes (for wafer) consist of higher isotropic olefin backing and UV peeling adhesive.
For all kinds of wafer dicing
Dicing tape(for Wafer)
High fixation power
Thickness (mm):0.100
Test Item | Unit | Value | ||
Adhesion | N/10mm | 3.20 | ||
Tack | Ball No. | - | ||
Holding power | Creep mm/24h | <0.1 | ||
Adhesion | To UV | N/10mm | 0.22 |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N