- 高层数: 60层 - 高密度设计 High Density Design): 内层线宽/线距 3mil / 3mil (75um / 75um) - 背钻工艺: Backdrilling, Counter Bore, Depth Controlled Drilling; 单面背钻, 双面背钻, 多种深度 - 阻抗控制: Controlled Impedance - 高密度互连 / 激光孔: HDI (High Density Interconnection) / Laser Vias; 1+N+1, 2+N+2 - 盲/埋孔板: Blind / Buried Vias - 树脂填孔(堵孔/塞孔) + 盖帽电镀铜工艺: POFV (Plating Over Filled Vias) - 厚铜板: Heavy Copper, 3~..