台中半导体材料汉高ABLESTIKJM7000导电胶,乐泰导电胶

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.

TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150ºC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300ºC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300ºC
Chip Size: ROC
15 x 15 mm > 5

ABLESTIK 5020胶膜 绝缘胶膜

广州5020胶膜 深圳汉高5020胶膜 西安ablesitk 5020胶膜 山东ablestik5020胶膜 石家庄导电胶 河北导电胶 上海导电胶