单面铝基板UL仅燃烧认证

These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
Cover
Transmittal
Table of Contents
Body
INTRODUCTION
1 Scope
2 Glossary
3 Units of Measurement
4 Measurement Accuracy and Testing Conditions
5 Supplementary Test Procedures
6 References
7 General
CONSTRUCTION
8 General
9 Base Materials
9.1 General
9.2 Metal-clad base material
9.3 Direct support
10 Conductors
10.1 Materials
10.2 Silver
10.3 Conductive coating
10.4 Edges and width
10.5 Pattern surfaces
10.6 External copper foil or cladding process weight
10.7 Midboard conductor
10.8 Edge conductor
10.9 Maximum unpierced conductor area
10.10 Contact surface plating
10.11 Plated-through holes
10.12 Additional conductive plating
10.13 Solder limits
10.14 Pattern
11 Adhesives for Conductor Bonding
12 Processes
12.1 General
12.2 Multiple-site processing
13 Permanent Coatings
13.1 General
13.2 Permanent coatings program
14 Plugged-Hole Materials
15 Embedded Components
16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
16.1 General
16.2 Metal-clad (MCIL/CCIL) base material program
17 Multilayer Printed-Wiring Boards
17.1 General
17.2 Assembly
17.3 Mass laminate printed wiring boards
17.4 Electrical insulation
17.5 Laminations
17.6 Dissimilar dielectric materials evaluation
17.7 Interlayer connections
17.8 Metal-clad laminate and prepreg materials
18 Metal Base Printed-Wiring Boards
18.1 General
18.2 Vertical flammability evaluation for metal base PWBs
18.3 Bond strength evaluation for metal base PWBs
19 Flexible Printed-Wiring Boards
20 Variations In Printed-Wiring Board Construction
PERFORMANCE
21 Test Samples
22 Data Collection
23 Microsection Analysis
23.1 General
23.2 Test samples
23.3 Etching the sample surface
23.4 Material and test pattern parameter examination
24 Thermal Shock
25 Flammability
25.1 General
25.2 Samples
25.3 Conditioning
26 Bond Strength
26.1 After thermal shock
26.2 As received
26.3 Oven conditioning
27 Delamination and Blistering
28 Dissimilar Dielectric Materials Thermal Cycling Test
28.1 General
28.2 Thermal cycling
29 Plating Adhesion
30 Conductive Paste Adhesion Test
31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
31.1 General
31.2 HDI Vertical flammability evaluation
31.3 HDI Bond strength, delamination and blistering evaluation
31.4 Test programs for HDI PWB construction variations
32 Silver Migration Test
32.1 General
32.2 Procedure
32.3 Results
MARKINGS
33 General
FOLLOW-UP INSPECTION

代理范围
部分：初次申请
（一）单层板全流程申请
（二）预制多层板全流程申请
（三）多层板全流程申请
（四）单层板+多层板）全流程申请
（五）金属基板全流程申请
（六）HDI板全流程申请
（七）柔性线路板全流程申请
第二部分：物料/单项制称新增
（一）单种型号的基板申请
（二）单种型号PP申请
（三）单种型号的阻焊油墨申请
（四）新增工艺步骤
（五）新增外包商
（六）新增多个生产地
（七）新增制造商
（八）线宽变更/塞孔增加
(九)变更基板厚度/燃烧等级/铜厚/
(十)新增“▲”标志
（十一）裸铜面积/焊接温度/制程温度变更
第三部分：翻译服务
（一）UL文件中文翻译/UL跟踪检验细则中文翻译
（二） UL标准中文翻译
（三）UL往来信函/E-mail中文翻译
第四部分：补充服务
（一）UL证书镀金表框
（二）黄卡申购
（三）订购UL标准
第五部分：全年承包服务
（一）负责全年的材料报备及新增制程的申请及UL相关文件资料维护。
（二）负责全年的UL跟踪检查维护和与UL工程师的沟通交流。
（三）提供一年免费的电话咨询，UL英文资料翻译及Email解答
（四）提供1次/月的现场改善指导;
（五）提供UL检查前培训辅导
第六部分：
（一）其它和UL有关的相关产业。
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